docs [EPS@ISEP]

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^ Description 			^ Link(s) ^
|Interim Report			| Available at MS Teams |
|Interim Presentation		| {{ ::interim_presentation_1_.pdf | IPresentation}}|
|Flyer				| {{ ::flyer_bibolink_team5.pdf | Flyer}}|
|Leaflet			| {{ :leaflet_bibolink.pdf | Leaflet }} {{:leaflet_mockup.png?400| }}|
|List of Materials & Components	| {{ ::final_list_of_components.pdf | }}|
|3D Model Video			| {{ :3dmodel_video.mp4 | 3D Model Video}}|
|Drawings			| {{ :drawings.pdf | Drawings}} |
|Packaging			| {{ :packagingsolution.pdf | Packaging}}|
|Simulations			| {{ :simulation_files.rar | Simulation files}} \\ {{ :stresssim_analysis_bibolink_final.pdf | PDF}}|
|Final Report			| Available at MS Teams |
|Final Presentation		| {{ ::endpresentation_group5_1_.pdf | FPresentation }}{{ :endpresentation_group5.pptx | FPresentation}}|
|Paper				| Accepted at ICL 2025 (available at Overleaf)    |
|Poster				| {{ :poster_bibolink.pdf |}}| 
|Code				| {{ :bibolink_microcontroller_code-main.zip | Code}} |
|Manual				| {{ ::manual_bibolink.pdf |}} |
|Video				| {{ :video.mp4 | Video}} |
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