|< 100% 220px >| ^ Description ^ Link(s) ^ |Interim Report | Available at MS Teams | |Interim Presentation | {{ ::interim_presentation_1_.pdf | IPresentation}}| |Flyer | {{ ::flyer_bibolink_team5.pdf | Flyer}}| |Leaflet | {{ :leaflet_bibolink.pdf | Leaflet }} {{:leaflet_mockup.png?400| }}| |List of Materials & Components | {{ ::final_list_of_components.pdf | }}| |3D Model Video | {{ :3dmodel_video.mp4 | 3D Model Video}}| |Drawings | {{ :drawings.pdf | Drawings}} | |Packaging | {{ :packagingsolution.pdf | Packaging}}| |Simulations | {{ :simulation_files.rar | Simulation files}} \\ {{ :stresssim_analysis_bibolink_final.pdf | PDF}}| |Final Report | Available at MS Teams | |Final Presentation | {{ ::endpresentation_group5_1_.pdf | FPresentation }}{{ :endpresentation_group5.pptx | FPresentation}}| |Paper | Accepted at ICL 2025 (available at Overleaf) | |Poster | {{ :poster_bibolink.pdf |}}| |Code | {{ :bibolink_microcontroller_code-main.zip | Code}} | |Manual | {{ ::manual_bibolink.pdf |}} | |Video | {{ :video.mp4 | Video}} |